| Rigid PCB Capacity for Prototypes PCBs and Mass Production |
| Features | Mass Capability | Prototypes Capability |
| Layers | 1-24 layers | 1-64 layers |
| Board material type | FR4(Standard FR4, Mid-Tg FR4,Hi-Tg FR4),CEM-1,ceramic substrate board, aluminum based board, Rogers , Teflon and more | FR4(Standard FR4, Mid-Tg FR4,Hi-Tg FR4),CEM-1, CEM-3,ceramic substrate board, aluminum based board, Rogers , Teflon and more |
| Max. PCB Panel Size | 1150*560mm | 1150*560mm |
| Board thickness coverage | .016"-.126"(0.4mm-3.2mm) | 0.2 to 5.00mm |
| Min. Board Thickness | 2L:0.2mm | 2L:0.2mm |
| 4L:0.4mm | 4L:0.4mm |
| 6L:0.8mm | 6L:0.6mm |
| Board thickness tolerance | ±10% | ±10% |
| Min Inner Layer Tracing/Spacing | 0.1mm(4mil) | 0.1mm(4mil) |
| Min outside layer Min Tracing/Spacing | 0.075mm(3/3mil) | 0.075mm(3/3mil) |
| Min drilling Hole diameter | 0.15mm(6mil) | 0.15mm(6mil) |
| Min plated hole thickness | 20um(0.8mil) | 20um(0.8mil) |
| Min Blind/Buried hole size | 0.2mm(8mil) | 0.2mm(1-8layers)(8mil) |
| Min Annular Ring | ±0.076mm(±3mil) | ±0.076mm(±3mil) |
| Hole Position Deviation | ±0.05mm(±2mil) | ±0.05mm(±2mil) |
| Min width of cutout (NPTH) | 0.8mm | 0.8mm |
| Min width of slot hole (PTH) | 0.6mm | 0.6mm |
| Solder mask color | LPI, Green, Green matt, Black, Black Matt, White, Red, Yellow, Blue | LPI, Green, Black, White, Red, Yellow, Blue |
| Silkscreen color | White, Yellow, Red, Black | White, Yellow, Red, Black |
| Surface finish | HASL ,Lead Free HASL | HASL ,Lead Free HASL |
| ENIG, Immersion Tin - RoHS | ENIG, Immersion Tin - RoHS |
| OSP, ENIG+OSP, Immersion Silver, Gold Finger | OSP, ENIG+OSP, Immersion Silver, Gold Finger |
| Special Process | Buried Hole,Blind Hole, Embedded Resistance, Back drillingand Resistance Control. | Buried Hole,Blind Hole, Embedded Resistance, Back drillingand Resistance Control. |
| Outline | Routing, V-Groove, Beveling punch | Routing,V-Groove, Beveling punch |
| Outline Tolerance | ±0.15mm ±6mil | ±0.15mm (±6mil) |
| Board thickness tolerance | +/-0.1mm ~ +/-10% | +/-0.1mm ~ +/-10% |
| Board size tolerance | +/-0.1mm~+/-0.3mm | +/-0.1mm~+/-0.3mm |
| PTH hole size tolerance | +/-.003"(+/-0.08mm)~+/-.006"(+/-0.15mm) | +/-.003"(+/-0.08mm)~+/-.006"(+/-0.15mm) |
| NPTH hole size tolerance | +/-.002"(+/-0.05mm) | +/-.002"(+/-0.05mm) |
| Controlled Impedance | +/- 10% | +/- 7% |
| Insulation Resistance | 1×1012Ω(Normal) | 1×1012Ω(Normal) |
| Through Hole Resistance | <300Ω(Normal) | <300Ω(Normal) |
| Thermal Shock | 3×10sec@288℃ | 3×10sec@288℃ |
| Warp and Twist | ≤0.7% | ≤0.7% |
| Electric Strength | >1.3KV/mm | >1.4KV/mm |
| Peel Strength | 1.4N/mm | 1.4N/mm |
| Solder Mask Abrasion | >6H | >6H |
| Flammability | 94V-0 | 94V-0 |
| Test Voltage | 50-330V | 50-330V |
