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TG170 FR4 Multilayer Printed Circuit Board Process Printed Wiring Board Assembly

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Shenzhen Jingxin Electronic Technology Co., Ltd.

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TG170 FR4 Multilayer Printed Circuit Board Process Printed Wiring Board Assembly

Name: TG170 FR4 Multilayer Printed Circuit Board Process Printed Wiring Board Assembly
Brand: JINGXIN
Price: 1 USD

Quality TG170 FR4 Multilayer Printed Circuit Board Process Printed Wiring Board Assembly for sale

Brand Name : JINGXIN

Model Number : Customized

Certification : UL, Rohs

Place of Origin : CHINA

MOQ : 1 PC

Price : Negotiation

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 30000pcs per day

Delivery Time : 5-7 days

Packaging Details : ESD Bag

Material : TG170 FR4

Customized : YES

Legend : White

Quote needs : PCB Gerber file

Product Type : RGD ROHS PCB

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TG170 FR4 Multilayer Printed Circuit Board Process Printed Wiring Board Assembly

Welcome to JINGXIN!

PCB , PCBA , FPC , MCPCB

JINGXIN Technology Co.,Ltd is built up in 1997 to focus on the Electronic Manufacturing Services , which specializes in PCB fabrication and PCB Assembly , including FR4 PCB, Rogers PCB, Rigid-Flex PCB ,LED PCB , PCBA , MCPCB, FPC etc.

We offer one-stop service, consisting of reasonable quote, layout/design, copy (Gerber, BOM), fabrication, component sourcing, assembly (SMT, DIP, COB ), advanced testing, well packing, fast delivery and after-sales service.

Quality first, lead time second, NO MOQ , we shall start with prototype/sample

Multilayer PCB board

JINGXIN, your single point of contact for all of your raw materials, pcb parts, and pcb assembly, also offers

- Contract Manufacturing
- Engineering Services
- PCB Design,Manufacture & Assembly

- Single-sided, double-sided, multilayer PCB, PCBA, FPC ,SMT and DIP products

PCB Capacity

PCB General Capability
Number of Layer	1 - 18 Layer
Maximum Processing Area	680 × 1000MM
Min Board Thickness	2 Layer - 0.3MM ( 12 mil )
	4 Layer - 0.4MM ( 16 mil )
	6 Layer - 0.8MM ( 32 mil )
	8 Layer - 1.0MM ( 40 mil)
	10 Layer - 1.1MM ( 44 mil )
	12 Layer - 1.3MM ( 52 mil )
	14 Layer - 1.5MM ( 59 mil )
	16 Layer - 1.6MM ( 63 mil )
	18 Layer - 1.8MM ( 71 mil )
Finished Board Thickness Tolerance	Thickness ≤ 1.0MM, Tolerance: ± 0.1MM
Finished Board Thickness Tolerance	1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending	≤ 0.75%, Min: 0.5%
Range of TG	130 - 215 ℃
Impedance Tolerance	± 10%, Min: ± 5%
Hi-Pot Test	Max: 4000V/10MA/60S
Surface Treatment	HASL, With Lead, HASL Free Lead
	Flash Gold, Immersion Gold
	Immersion Silver, Immersion Tin
	Gold Finger, OSP

PCB Cu Thickness + Plating
Out Layer Cu Thickness	1 - 6OZ
Inner Layer Cu Thickness	0.5 - 4OZ
Cu Thickness of PTH	20UM ≤ Average ≤ 25UM
Cu Thickness of PTH	Min: 18UM
HASL with Lead	Tin 63% Lead 37%
HASL Free Lead	7UM ≤ Surface Thickness ≤ 12UM
Thick Gold Plating	Ni Thickness: 3 - 5UM ( 120u" - 200u" )
Thick Gold Plating	Gold Thickness: 0.025 - 1.27UM ( 1u" - 50u" )
Immersion Gold	Ni Thckness: 3 - 5UM ( 120u" - 200u" )
Immersion Gold	Gold Thickness: 0.025 - 0.15UM ( 1u" - 3u" )
Immersion Silver	Ag Thickness: 0.15- 0.75 UM ( 6u" - 30u" )
Gold Finger	Ni Thickness: 3 - 5UM ( 120u" - 160u" )
Gold Finger	Gold Thickness: 0.025 - 1.51UM ( 1u" - 60u" )

U940 PCB Pattern Limit Capability
Min Width	0.075MM ( 3 mil )
Min Trace	0.075MM ( 3 mil )
Min Width of Ring ( Inner Layer )	0.15MM ( 6 mil )
Min Width of Ring ( Out Layer )	0.1MM ( 4 mil )
Min Solder Bridge	0.1MM ( 4 mil )
Min Height of Legend	0.7MM ( 28 mil )
Min Width of Legend	0.15MM ( 6 mil )

PCB Holes Processing Capability
Final Hole Size	Min: Laser 0.1MM, Machine 0.2MM
Drilling Hole Size	0.10 - 6.5MM
Drilling Tolerance	NPTH: ±0.05MM, PTH: ±0.075MM
Final Hole Size Tolerance ( PTH )	φ0.20 - 1.60MM ± 0.075MM
Final Hole Size Tolerance ( PTH )	φ1.60 - 6.30MM ± 0.10MM
Final Hole Size Tolerance ( NPTH )	φ0.20 - 1.60MM ± 0.05MM
Final Hole Size Tolerance ( NPTH )	φ1.60 - 6.50MM ± 0.05MM
Drilling Strip Hole	-0L ~tu.'gth /width 2:1
	Min Strip Hole Width 0.65MM
	Length & Width Tolerance ± 0.05MM
Board Thickness / Hole Size	≤ 10:1

PCB Cover Thickness Capability
Solder Mask Color	Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White
Solder Mask Thickness	Surface Line ≥ 10UM
	Surface Line Corner ≥ 6UM
	Surface Board 10 - 25UM
	Solder Mask Bridge Width
Legend Color	White,Yellow,Black
Min Height of Legend	0.70MM ( 28 mil )
Min Width of Legend	0.15MM ( 6 mil )
Blue Gel Thickness	0.2 - 1.5MM
Blue Gel Tolerance	±0.15MM
Carbon Print Thickness	5 - 25UM
Carbon Print Min Space	0.25MM
Carbon Print Impedance	200Ω

Blind/Burried/Half Via PCB Capability
Parameters	(1+1)e.g. (4-layer)blind via:1-2,2-4 (6-layer)buried via:2-3,3-4 (8-layer)blind/buried:1-3,4-5,6-8
Min Via	Laser 0.1MM, Machine 0.2MM
Half Via	Min: 0.6MM

Impedance Capability
Resistance Value	Single-ended 50 - 75Ω, Difference 100Ω, Coplanar 50 - 75Ω

PCB Photos

Product Tags:

multilayer circuit board

multilayer pcb fabrication

TG170 FR4 Multilayer Printed Circuit Board Process Printed Wiring Board Assembly Images

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