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Immersion Gold Surface Multilayer PCB Manufacturing 10 Layers Electronic Circuit Panel

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Immersion Gold Surface Multilayer PCB Manufacturing 10 Layers Electronic Circuit Panel

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Brand Name : JINGXIN

Model Number : JX18112725

Certification : UL, Rohs

Place of Origin : CHINA

MOQ : 1 PC

Price : Negotiation

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 30000pcs per day

Delivery Time : 5-7 days

Packaging Details : ESD Bag

Profiling Punching : V-cut, Rounting, Beveling

Surface : Immersion Gold

Number Of Layer : 10 Layers

Legend : White

Quote needs : PCB Gerber file

Product Type : RGD ROHS PCB

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Immersion Gold Surface Multilayer PCB Manufacturing 10 Layers Electronic Circuit Panel

Our Services

Quotation time:

1. For PCB & FPC: quotation within 1 hours if all information are clear
2. For PCBA: quotation within 2 days if all information are clear

Quote Requirements For PCB and PCB Assembly :

- Gerber File and Bom List;
- Quote Quantity;
- Technical requirements for quoting reference;
- Clear pictures of PCB or PCB Assembly sample if available.
- Inspection method for PCB Assembly.

PCBA, PCB Board assembly: SMT & PTH & BGA

· PCBA and enclosure design

· Components sourcing and purchasing

· Quick prototyping

· Plastic injection molding

· Metal sheet stamping

· Final assembly

· Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)

· Custom clearance for material importing and product exporting

led pcb board manufacturer

Multilayer 10 layers PCB board

The high technology as a starting point,the use of first-class equipment and raw material production and sales of high precision ,high density multi-layer LCD as our products and technology development direction,build up the company:"linePossess first-class PCB enterprise"as our vision ,to provide high quality electronic information industry PCB production Satisfactory products and sincere service" as our mission.

Advantages

- No MOQ

- OEM services provided

- Heavy copper PCB, Heavy gold PCB, Blind / Buried via PCB, High layer count PCB manufacturable

- Factory direct price

- Replying with price in one working day

- Shipping within 24 hours

- Certificate: ROHS, UL, ISO9001-2000, ISO14001,SGS Lead-Free

PCB Capacity

PCB General Capability
Number of Layer 1 - 18 Layer
Maximum Processing Area 680 × 1000MM
Min Board Thickness 2 Layer - 0.3MM ( 12 mil )
4 Layer - 0.4MM ( 16 mil )
6 Layer - 0.8MM ( 32 mil )
8 Layer - 1.0MM ( 40 mil)
10 Layer - 1.1MM ( 44 mil )
12 Layer - 1.3MM ( 52 mil )
14 Layer - 1.5MM ( 59 mil )
16 Layer - 1.6MM ( 63 mil )
18 Layer - 1.8MM ( 71 mil )
Finished Board Thickness Tolerance Thickness ≤ 1.0MM, Tolerance: ± 0.1MM
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending ≤ 0.75%, Min: 0.5%
Range of TG 130 - 215 ℃
Impedance Tolerance ± 10%, Min: ± 5%
Hi-Pot Test Max: 4000V/10MA/60S
Surface Treatment HASL, With Lead, HASL Free Lead
Flash Gold, Immersion Gold
Immersion Silver, Immersion Tin
Gold Finger, OSP
PCB Cu Thickness + Plating
Out Layer Cu Thickness 1 - 6OZ
Inner Layer Cu Thickness 0.5 - 4OZ
Cu Thickness of PTH 20UM ≤ Average ≤ 25UM
Min: 18UM
HASL with Lead Tin 63% Lead 37%
HASL Free Lead 7UM ≤ Surface Thickness ≤ 12UM
Thick Gold Plating Ni Thickness: 3 - 5UM ( 120u" - 200u" )
Gold Thickness: 0.025 - 1.27UM ( 1u" - 50u" )
Immersion Gold Ni Thckness: 3 - 5UM ( 120u" - 200u" )
Gold Thickness: 0.025 - 0.15UM ( 1u" - 3u" )
Immersion Silver Ag Thickness: 0.15- 0.75 UM ( 6u" - 30u" )
Gold Finger Ni Thickness: 3 - 5UM ( 120u" - 160u" )
Gold Thickness: 0.025 - 1.51UM ( 1u" - 60u" )
U940 PCB Pattern Limit Capability
Min Width 0.075MM ( 3 mil )
Min Trace 0.075MM ( 3 mil )
Min Width of Ring ( Inner Layer ) 0.15MM ( 6 mil )
Min Width of Ring ( Out Layer ) 0.1MM ( 4 mil )
Min Solder Bridge 0.1MM ( 4 mil )
Min Height of Legend 0.7MM ( 28 mil )
Min Width of Legend 0.15MM ( 6 mil )
PCB Holes Processing Capability
Final Hole Size Min: Laser 0.1MM, Machine 0.2MM
Drilling Hole Size 0.10 - 6.5MM
Drilling Tolerance NPTH: ±0.05MM, PTH: ±0.075MM
Final Hole Size Tolerance ( PTH ) φ0.20 - 1.60MM ± 0.075MM
φ1.60 - 6.30MM ± 0.10MM
Final Hole Size Tolerance ( NPTH ) φ0.20 - 1.60MM ± 0.05MM
φ1.60 - 6.50MM ± 0.05MM
Drilling Strip Hole -0L ~tu.'gth /width 2:1
Min Strip Hole Width 0.65MM
Length & Width Tolerance ± 0.05MM
Board Thickness / Hole Size ≤ 10:1
PCB Cover Thickness Capability
Solder Mask Color Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White
Solder Mask Thickness Surface Line ≥ 10UM
Surface Line Corner ≥ 6UM
Surface Board 10 - 25UM
Solder Mask Bridge Width
Legend Color White,Yellow,Black
Min Height of Legend 0.70MM ( 28 mil )
Min Width of Legend 0.15MM ( 6 mil )
Blue Gel Thickness 0.2 - 1.5MM
Blue Gel Tolerance ±0.15MM
Carbon Print Thickness 5 - 25UM
Carbon Print Min Space 0.25MM
Carbon Print Impedance 200Ω
Blind/Burried/Half Via PCB Capability
Parameters

(1+1)e.g.

(4-layer)blind via:1-2,2-4

(6-layer)buried via:2-3,3-4

(8-layer)blind/buried:1-3,4-5,6-8
Min Via Laser 0.1MM, Machine 0.2MM
Half Via Min: 0.6MM
Impedance Capability
Resistance Value Single-ended 50 - 75Ω, Difference 100Ω, Coplanar 50 - 75Ω

PCB Photos

Immersion Gold Surface Multilayer PCB Manufacturing 10 Layers Electronic Circuit Panel


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